Dictionary AllABCDEFGHIJKLMNOPQRSTUVWXAAcceptance Quality Level (AQL)AOIApertureAspect Ratio (Stencil)AssemblyAutomatic Optical Inspection (AOI)BBack BondingBGA (Ball Grid Array)BlisterBondBondabilityBonding WireBreakawayBumped WaferBurn-InBurrCCapability Test Board (CTB)Ceramic Dual-in-line Package (CERDIP)Ceramic Pin Grid Aray (CPGA)Ceramic Quad Flat Pack (CQFP)Chip Scale Package (CSP)Chip-in-Board (CIB)Chip-on-Board (COB)Chip-on-Flex (COF)Cold Solder ConnectionConformal CoatingCupping (BGA)DDamage Response (Plastic Encapsulated SMDs)DelaminationDestructive Physical Analysis (DPA)DewettingDisturbed solder connectionDoming (BGA)Dual-Inline Package (DIP)EElectrical ClearanceElectromagnetic Compatibility (EMC)Electrostatic Discharge (ESD)Electrostatic Discharge Sensitive devices (ESDS)Electrostatic dissipativeEmbedded ComponentEnvironment Controlled AreaESD – Protected Area (EPA)FFace BondingFatigue LifeFatigue LimitFiducialFine-Pitch BGA/ CSP (Chip Scale Package)Fine-Pitch QFPFine-Pitch Technology (FPT)Flex-Rigid Printed BoardFlexible Printed BoardFlip ChipFloor LifeFunctional TesterGGlob-Topped EncapsulationGo/No-Go TestGuide PinGull Wing LeadsHHead in PillowHead on PillowHeel FilletHigh Density Interconnect (HDI)High Density Plastic Quad Flat PackHole BreakoutHumidity Indicator Card (HIC)Hybrid CircuitIIn-Circuit TestingInclusion, Foreign MaterialInorganic FluxInterposerIntrusive SolderingIPC StandartJJ-LeadsJet Wave SolderingJumper WireJust-In-Time (JIT)KKerfKnown Good Board (KGB)Known Tested Die (KTD)KovarLLaminateLaminate VoidLand Grid Array (LGA)Laser TrimmingLead Free (Solder)MMaskMeniscusMoisture Sensitivity Level (MSL)Mouse Bite (Low Stress Breakaway)Multichip Module (MCM)Multichip Package (MCP)NNail HeadingNegative EtchbackNonconformingNonfunctional LandNonwetting (Solder)OOutgassingOverheated Solder ConnectionPPackage on package (PoP)Pin-In-HolePin-In-PastePrinted ComponentProcess IndicatorQQuad Flad J-Lead (QFJ)Quad Flad Pack (QFP)Quad Flad Pack with Bumper (QFPB)RReflow solderingResist (Mask)Rigid-Flex Printed BoardSSelective SolderingSelf-Alignment EffectSolder BallSolder BumpSolder ConnectionSolder JointSolder MaskSolder Mask ApertureSolder ResistStand-OffStencilStep StencilStress ReliefSurface Mount AssemblySurface Mount Component (SMC)Surface Mount Device (SMD)Surface Mount Technology (SMT)TThrough-Hole MountingThrough-Hole Technology (THT)TinningTombstoned ComponentTrayTrimmingUUltra-Fine Pitch TechnologyUltrasonic BondUltrasonic CleaningUltrasonic SolderingVV-Groove (Scoring)ValidationVerificationViaVoidWWaferWave SolderingWettingWire BondingXX-OutX-Ray inspection
