Push-Pull and Shear are destructive methods for testing of mechanical joints, soldering electronic components to PCBs, glued or welded mechanical parts and others.The tests are performed according to the customer specification and according to the requirements of standards MIL-STD-883 and IPC-TM-650.

– Scope of tests:

Push-Pull: 100 ÷ 1000 N
Shear, with rotation: 100 N
Shear, without rotation: 2000 N
– Maximum sample size for test:

Length: 370 mm
Width: 168 mm
Height: 168 mm

X-ray analysis is a non-destructive method for quality assessing of invisible for the human eye solders of electronic components (BGA, QFN, etc.), calculation of voids in heat-emitting sites and BGA and the condition of the inner layers of PCBs. The resolution of the X-ray system is 1 µm.
The analysis of PCBs is performed according to the requirements of standard IPC-A-600 and IPC-A-610 for assembled PCBs or according to acceptance criteria set by the client.

– Maximum sample size for inspection and analysis:

Length: 370 mm
Width: 168 mm
Height: 168 mm

The repair works are:

– Disassembly and Assembly with automatic repair station of SMT components delivered by the customer – chip type, QFP, QFN, BGA, CSP, connectors, etc .;

– Replacement of supplied by the customer TH components;

Verification of the performed activities through visual inspection and X-ray analysis.

The repair activities of assembled PCBs are performed according to the requirements of standard IPC 7711/7721 or to the method and profile set by the customer.

– Maximum assembled PCBs size:

Length: 390 mm
Width: 285 mm

Temperature tests include:

– Cyclic exposure of the samples to extremely low and high temperatures according to standard JESD22-A104 or according to a profile set by the customer;

– BURN IN / RUN IN tests with customer test setup.

Temperature range from – 40 ° C to + 180 ° C, with a maximum temperature change gradient of 4.0 K / min.

– Work area size:

Length: 800 mm
Width: 800 mm
Height: 950 mm
Мaximum approved total weight of the samples, divided into 4 pcs. shelves: 160 kg

The cleaning process includes:

– Removal of flux residues and other contaminants on the solders and surface of the PCBs from the soldering process of SMT and TH components;

– Drying of assembled PCBs;

Verification of cleaning through visual inspection according to the requirements of standard IPC-A-610.

The process includes:

– Removal of residual moisture from moisture-sensitive electronic components and PCBs, according to the requirements of standard IPC-J-STD-033 or to customer specification.

– Packaging in moisture-proof packaging, with the possibility to ensure maintenance of relative humidity ≤ 5%.

Along with EMS services, it is possible to perform single operations such as cleaning, assembling and packaging of electronic, optical and mechanical modules according to customer specifications.

Ние използваме бисквитки, за да ви предоставим най-доброто онлайн изживяване. Като се съгласявате, приемате използването на бисквитки в съответствие с нашата политика за бисквитки.

Close Popup
Privacy Settings saved!

Когато посещавате който и да е уеб сайт, той може да съхранява или извлича информация във вашия браузър, най-вече под формата на бисквитки. Контролирайте вашите лични услуги за бисквитки тук.

Откажете всички
Приемете всички Услуги
Open Privacy settings