useredit
Chip-in-Board (CIB)
An electronic component where a chip is inserted into an opening of a ceramic of glass-epoxy substrate and …
Chip-on-Board (COB)
A printed board assembly technology that places unpackaged semiconductor dice and interconects them by a wire bonding or …
Chip-on-Flex (COF)
Semiconductor chip mounted directly onto flexible printed board …
Cold Solder Connection
A solder connection that exhibits poor wetting, and that is characterized by a grayish, porous appearance. (This is …
Conformal Coating
Conformal Coating providing a protective barrier against deleterious effects from enviromental conditions. Conformal Coating is an insulating protective …
Cupping (BGA)
A condition of a ball grid array (BGA) package after reflow where the corners turn up and away …
Damage Response (Plastic Encapsulated SMDs)
All irreversible changes caused by exposure to a reflow soldering profile. …
Delamination
Delamination is a separation between plies within a base materialq between a base material and a conductive foilq …
Destructive Physical Analysis (DPA)
A process of determination of device construction or failure modes. …
