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Disturbed solder connection
A solder connection that is characterized by the appearance that there was motion between the metals being joined …
Doming (BGA)
A condition of a ball grid array (BGA) package after reflow where the corners turn down and toward …
Dual-Inline Package (DIP)
An electronic device package with a rectangular housing and two parallel rows of electrical connecting pins, usually protruding …
Electrical Clearance
The shortest distance between two conductors, which includes traces, terminals and structures, measured through air. …
Electromagnetic Compatibility (EMC)
A device’s ability to function properly in its operating environment without causing electromagnetic interference to other equipment, or …
Electrostatic Discharge (ESD)
The rapid spontaneous transfer of electrostatic charge, induced by a high electrostatic field. …
Electrostatic Discharge Sensitive devices (ESDS)
An electrostatic-sensitive device is any electrical component which can be damaged by common static charges which build up …
Electrostatic dissipative
Dissipative materials allow the charges to flow to ground more slowly in a more controlled manner than with …
Embedded Component
A discrete component that is fabricated as an integral part of a printed board. …
