Environment Controlled Area
A controlled environment area is a specified working area that primarily controls one or more physical, chemical, or …
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ESD – Protected Area (EPA)
ESD Protected Areа is a workplace or area that provides protection against damage due to ESD. …
Face Bonding
Attaching a die to a base material with its circuitry facing the base material. …
Fatigue Life
The number of cycles of stress that can be sustained prior to failure for a stated test condition. …
Fatigue Limit
The maximum stress below which a material can presumably endure an infinite number of stress cycles. …
Fine-Pitch BGA/ CSP (Chip Scale Package)
A surface-mount assembly technology with component terminations less than 0.65mm [0.025 in] centers. See also “Ultra Fine-Pitch Technology” …
Fine-Pitch QFP
A quad flad pack (QFP) package with the lead pitch at or less than 0.65mm [0.039 in] pitch …
Fine-Pitch Technology (FPT)
A surface-mount assembly technology with component terminations less than 0.65mm [0.025 in] centers. See also “Ultra Fine-Pitch Technology”. …
