Archives: Речник

The ability of a surface to be bonded, dependent upon degree of surface preparation, as in cleanliness and …

Fine gold or aluminium wire used for making electrical connections between lands, lead frames, and terminals. …

The function of excising pronted boards or printed board assemblies from their panel structure after all processing has …

A semiconductor wafer with raised metal features on its die lands that facilitate inner-lead bonding. …

Burn-In is the process of electrically stressing a device at an elevated temperature, for sufficient amount of time …

Small lumps or masses with an irregular shape, convex to a surface, which occur as a result of …

A printed board specifically designed to act as a capability qualifying component (CQC), or to be used by …

A dual in-line-package that has a package body of ceramic material and hermetically sealed by glass. (See also …

A pin grid aray package (PGA) made of a ceramic material, hermetically sealed by metal, with leads formed …

A quad flad pack (QFP) made of a ceramic material, hermetically sealed by metal, with leads extending grom …