Archives: Речник

A pallet shape that contains SMD components in a form that makes it easy to feed them to …

The removal of material from component by a laser beam or abrasive jet in order to modify its …

A surface-mount assembly technology with component terminations on centers less than or equal to 0.40 mm [0.0157 in]. …

A bond formed when a wire is pressed against the bonding pad and the pressing mechanism is ultrasonically …

Immersion cleaning that is done by passing high-frequency soundwaves through a cleaning medium to cause microagitation. …

Fluxless soldering wherein molten solder is vibrated as ultrasonic frequencies while making the joint. …

A mechanical method that removes a portion of the material outlining the board, in order to facilitate ease …

Establishing by objective evidence that a process consistently produces a result or product meeting its predetermined requirements. …

Confirmation by examination and provision of objective evidence that the specified requirements have been fulfilled. …

Via is a plated hole that is used as an interlayer connection but is not intended for inserting …