Archives: Речник

A stencil with more than one stencil-foil thickness. …

Slack in a component lead or wire that is formed in such a way as to minimize mechanical …

See “Surface Mount Technology (SMT)”. …

A leaded or leadless device (part) that is capable of being attached to a printed board by surface …

See “Surface Mount Component (SMC)”. …

The electrical connection of components to the surface of a conductive pattern that does not utilize component holes. …

See “Through-Hole Technology (THT)”. …

The electrical connection of components to a conductive pattern by the use of component holes. …

The application of molten solder to a basis metal or surface finish for improving solderavility. …

A defective mounting condition whereby a leadless device has only one of its metallized terminations soldered to a …