ENGINEERING LABORATORY AT CENTILLION

Along with the established services provided by the Engineering laboratory, CENTILLION has implemented new equipment and now offers Pull&Shear destructive testing of assembled printed circuit boards and materials in accordance with the requirements of MIL-STD-883 and IPC-TM-650 standards.

Measuring the strength of the Bond and having good knowledge of the strength qualities, from the product design process up to the control stage in subsequent serial production, in the electronics industry is directly related to the quality of the product, customer satisfaction and, last but not least, production profitability. The engineering laboratory at CENTILLION has already been equipped with Pull&Shear destructive testers for assembled printed circuit boards, components, materials and various types of casings. Bonding conductors, solder joints, BGAs, outlets, weldings as well as glued elements can be tested for Bond strength under a load of 0.5N up to 2,000N.

The Pull&Shear destructive tester has an open frame design and a large stroke of the movable modules. It is possible to test samples of various dimensions while using a small set of specialised tools. The tester is compatible with the most commonly used standard holders and allows quick disassembly and replacement of instruments and measurement units, ensuring precision and speed when working with different models and testing tasks.

The Pull&Shear test ensures the quality and endurance of your products.

With the addition of the Pull&Shear destructive testing, the services offered by CENTILLION’s Engineering laboratory are:

X-RAY analysis
IPC-A-610

BURN IN/RUN IN temperature testing
MIL-STD-883 and IPC-TM-650

DRYING of components
J-STD-020

REWORK of SMDs and conventional components, including BGA Reballing, Reflow, Preforms
IPC-A-610

PULL&SHEAR destructive testing
MIL-STD-883 and IPC-TM-650

VISUAL INSPECTION (ERSASCOPE, STEREO MICROSCOPE)
IPC-A-610

Cleaning assembled PCBs
IPC J-STD-001