Heel Fillet
The solder fillet formed in the land area behind the lead. …
High Density Interconnect (HDI)
A generic term for substrates or boards with a higher circuit density per unit area than conventional printed …
High Density Plastic Quad Flat Pack
A QFP with greater than 196 leads at a pitch of 0.4 millimeters …
Hole Breakout
A condition in which a hole is not completely surrounded by the land. …
Humidity Indicator Card (HIC)
A card on which a moisture-sensitive chemical is applied such that it will make a significant, perceptible change …
Hybrid Circuit
A circuit comprising insulating base material with various combinations of interconnected film conductors, film components, semiconductor dice, passive …
In-Circuit Testing
The application of test signals directly to a device’s input terminals and sensing the results directly from device’s …
Inclusion, Foreign Material
A foreign particle, metallic or nonmetallic, that may be entrapped in an insulating material, conductive layer, plating, base …
Inorganic Flux
An aqueos flux solution of inorganic acids and halides. …
Interposer
A material placed between two surfaces giving electrical insulation, redistribution of electrical connections, mechanical strenght and/or controlled mechanical …