Multichip Package (MCP)
A packaging that contains two or more dice and/or minimally-packaged dice. See also “Multichip Module (MCM)” …
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Nail Heading
The flared condition of copper on an inner conductive layer of a multilayer printed board that is caused …
Negative Etchback
Etchback in which the inner conductor layer material is recessed relative to the surrounding base material. …
Nonconforming
A departure of a quality characteristics from its intended level or state that occurs with severity sufficient to …
Nonfunctional Land
A land that is not connected electricaly to the conductive pattern layer. …
Nonwetting (Solder)
The inability of molten solder to form a metallic bond with the basis metal. …
Outgassing
The gaseous emission from a material exposed to heat or reduced air pressure,or both. …
Overheated Solder Connection
A solder connection that is characterized by solder surfaces that are dull, chalky, grainy, and porous or pitted. …
Package on package (PoP)
A configuration where two packaged integrated circuits are placed directly on top of each other. Can also be …
