{"id":6507,"date":"2023-02-14T16:24:27","date_gmt":"2023-02-14T14:24:27","guid":{"rendered":"https:\/\/official.ourcentillion.eu\/?page_id=6507"},"modified":"2023-02-27T11:41:17","modified_gmt":"2023-02-27T09:41:17","slug":"dict","status":"publish","type":"page","link":"https:\/\/centillion.eu\/en\/dict\/","title":{"rendered":"Dictionary"},"content":{"rendered":"<p>&nbsp;<\/p>\n<div class=\"wpg-list-wrapper wpg-list-wrapper-template-alphabet\"><div class=\"wpg-list-filter-container\"><div class=\"wpg-list-filter\"><span class=\"wpg-list-filter-row\"><a class=\" filter active\" data-filter=\"all\">All<\/a><a class=\" filter\" data-filter=\".wpg-filter-a\">A<\/a><a class=\" filter\" data-filter=\".wpg-filter-b\">B<\/a><a class=\" filter\" data-filter=\".wpg-filter-c\">C<\/a><a class=\" filter\" data-filter=\".wpg-filter-d\">D<\/a><a class=\" filter\" data-filter=\".wpg-filter-e\">E<\/a><a class=\" filter\" data-filter=\".wpg-filter-f\">F<\/a><a class=\" filter\" data-filter=\".wpg-filter-g\">G<\/a><a class=\" filter\" data-filter=\".wpg-filter-h\">H<\/a><a class=\" filter\" data-filter=\".wpg-filter-i\">I<\/a><a class=\" filter\" data-filter=\".wpg-filter-j\">J<\/a><a class=\" filter\" data-filter=\".wpg-filter-k\">K<\/a><a class=\" filter\" data-filter=\".wpg-filter-l\">L<\/a><a class=\" filter\" data-filter=\".wpg-filter-m\">M<\/a><a class=\" filter\" data-filter=\".wpg-filter-n\">N<\/a><a class=\" filter\" data-filter=\".wpg-filter-o\">O<\/a><a class=\" filter\" data-filter=\".wpg-filter-p\">P<\/a><a class=\" filter\" data-filter=\".wpg-filter-q\">Q<\/a><a class=\" filter\" data-filter=\".wpg-filter-r\">R<\/a><a class=\" filter\" data-filter=\".wpg-filter-s\">S<\/a><a class=\" filter\" data-filter=\".wpg-filter-t\">T<\/a><a class=\" filter\" data-filter=\".wpg-filter-u\">U<\/a><a class=\" filter\" data-filter=\".wpg-filter-v\">V<\/a><a class=\" filter\" data-filter=\".wpg-filter-w\">W<\/a><a class=\" filter\" data-filter=\".wpg-filter-x\">X<\/a><\/span><\/div><\/div><div class=\"wpg-list wpg-list-template-three-column\"><div class=\"wpg-list-block wpg-filter-a mix\" data-filter-base=\"a\"><h3 class=\"wpg-list-block-heading\">A<\/h3><ul class=\"wpg-list-items\"><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A specified maximum number of defects, expressed as percentage, that is considered to be acceptable quality and normally associated with statistically derived sampling plans.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/acceptance-quality-level-aql\/\" >Acceptance Quality Level (AQL)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Automatische optische Inspektion&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/aoi\/\" >AOI<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;An opening in a solder paste printing stencil.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/aperture\/\" >Aperture<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;The ratio of the width of the aperture to the thickness of the stencil-foil&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/aspect-ratio-stencil\/\" >Aspect Ratio (Stencil)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A number of parts, subassemblies or combination thereof joined together.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/assembly\/\" >Assembly<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Automatic machine control of CBAs&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/automatic-optical-inspection-aoi\/\" >Automatic Optical Inspection (AOI)<\/a><\/li><\/ul><\/div><div class=\"wpg-list-block wpg-filter-b mix\" data-filter-base=\"b\"><h3 class=\"wpg-list-block-heading\">B<\/h3><ul class=\"wpg-list-items\"><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Attaching a die to a base material with its circuitry facing away from the base material&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/back-bonding\/\" >Back Bonding<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A surface mount package wherein the balls for terminations are formed in a grid on the bottom of a package.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/bga-ball-grid-array\/\" >BGA (Ball Grid Array)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Delamination in the form of a localized swelling and separation between any of the layers of a laminated base material, or between base material and conductive foil or protective coating, or solder mask&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/blister\/\" >Blister<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Bond is an interconnection that performs a permanent electrical and\/or mechanical function&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/bond\/\" >Bond<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;The ability of a surface to be bonded, dependent upon degree of surface preparation, as in cleanliness and texture&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/bondability\/\" >Bondability<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Fine gold or aluminium wire used for making electrical connections between lands, lead frames, and terminals.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/bonding-wire\/\" >Bonding Wire<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;The function of excising pronted boards or printed board assemblies from their panel structure after all processing has been completed.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/breakaway\/\" >Breakaway<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A semiconductor wafer with raised metal features on its die lands that facilitate inner-lead bonding.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/bumped-wafer\/\" >Bumped Wafer<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Burn-In is the process of electrically stressing a device at an elevated temperature, for sufficient amount of time to cause the failure of marginal devices. This early failures of products are also known as Infant Mortality.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/burn-in\/\" >Burn-In<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Small lumps or masses with an irregular shape, convex to a surface, which occur as a result of a machine process such as drilling or gouging.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/burr\/\" >Burr<\/a><\/li><\/ul><\/div><div class=\"wpg-list-block wpg-filter-c mix\" data-filter-base=\"c\"><h3 class=\"wpg-list-block-heading\">C<\/h3><ul class=\"wpg-list-items\"><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A printed board specifically designed to act as a capability qualifying component (CQC), or to be used by manufacturer to evaluate process variation, provess control, or continuous improvement procedures.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/capability-test-board-ctb\/\" >Capability Test Board (CTB)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A dual in-line-package that has a package body of ceramic material and hermetically sealed by glass. (See also &quot;Dual-in-line Package.&quot;)&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/ceramic-dual-in-line-package-cerdip\/\" >Ceramic Dual-in-line Package (CERDIP)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A pin grid aray package (PGA) made of a ceramic material, hermetically sealed by metal, with leads formed on a grid extending from the bottom of the package.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/ceramic-pin-grid-aray-cpga\/\" >Ceramic Pin Grid Aray (CPGA)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A quad flad pack (QFP) made of a ceramic material, hermetically sealed by metal, with leads extending grom all four sides.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/ceramic-quad-flat-pack-cqfp\/\" >Ceramic Quad Flat Pack (CQFP)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;See &quot;Fine Pitch BGA\/Chip Scale Package&quot;&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/chip-scale-package-csp\/\" >Chip Scale Package (CSP)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;An electronic component where a chip is inserted into an opening of a ceramic of glass-epoxy substrate and bonded by wire bonding or TAB techniques. The object of this technique is to reduce the thickness of the COB assembly. The chip may be covered by a resin after bonding.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/chip-in-board-cib\/\" >Chip-in-Board (CIB)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A printed board assembly technology that places unpackaged semiconductor dice and interconects them by a wire bonding or similar attachment techniques. Silicon area density is usualy less than that of the printed board.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/chip-on-board-cob\/\" >Chip-on-Board (COB)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Semiconductor chip mounted directly onto flexible printed board&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/chip-on-flex-cof\/\" >Chip-on-Flex (COF)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A solder connection that exhibits poor wetting, and that is characterized by a grayish, porous appearance. (This is due to excessive impurities in the solder, inadequate cleaning prior to soldering, and\/or the insufficient application of heat during the soldering process.)&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/cold-solder-connection\/\" >Cold Solder Connection<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Conformal Coating providing a protective barrier against deleterious effects from enviromental conditions. Conformal Coating is an insulating protective covering that conforms to the configuration of the objects coated. For example printed boards, printed boards assembly.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/conformal-coating\/\" >Conformal Coating<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A condition of a ball grid array (BGA) package after reflow where the corners turn up and away from the printed board laminate surface. This condition in the worse case causes the balls on the outside row to be in tension and the balls in the center to be in compression. (Opposite of &quot;Doming (BGA).&quot;)&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/cupping-bga\/\" >Cupping (BGA)<\/a><\/li><\/ul><\/div><div class=\"wpg-list-block wpg-filter-d mix\" data-filter-base=\"d\"><h3 class=\"wpg-list-block-heading\">D<\/h3><ul class=\"wpg-list-items\"><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;All irreversible changes caused by exposure to a reflow soldering profile.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/damage-response-plastic-encapsulated-smds\/\" >Damage Response (Plastic Encapsulated SMDs)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Delamination is a separation between plies within a base materialq between a base material and a conductive foilq or any other planar separation within a printed board. For mechanical separation see &quot;Blister&quot; and &quot;Haloing&quot;&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/delamination\/\" >Delamination<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A process of determination of device construction or failure modes.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/destructive-physical-analysis-dpa\/\" >Destructive Physical Analysis (DPA)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Dewetting is a condition that results when molten solder coats a surface and then recedes to leave irregularly-shaped mounds of solder that are separated by areas that are covered with a thin film of solder and with the basis metal not exposed.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/dewetting\/\" >Dewetting<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A solder connection that is characterized by the appearance that there was motion between the metals being joined when the solder was solidifying.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/disturbed-solder-connection\/\" >Disturbed solder connection<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A condition of a ball grid array (BGA) package after reflow where the corners turn down and toward the printed board laminate surface. This condition in the worse case causes the balls on the outside row to be in compression and the balls in the center to be in tension. (Opposite of &quot;Cupping (BGA).&quot;)&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/doming-bga\/\" >Doming (BGA)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;An electronic device package with a rectangular housing and two parallel rows of electrical connecting pins, usually protruding from the longer sides of the package and bent downward.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/dual-inline-package-dip\/\" >Dual-Inline Package (DIP)<\/a><\/li><\/ul><\/div><div class=\"wpg-list-block wpg-filter-e mix\" data-filter-base=\"e\"><h3 class=\"wpg-list-block-heading\">E<\/h3><ul class=\"wpg-list-items\"><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;The shortest distance between two conductors, which includes traces, terminals and structures, measured through air.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/electrical-clearance\/\" >Electrical Clearance<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A device&#039;s ability to function properly in its operating environment without causing electromagnetic interference to other equipment, or itself being susceptible to external interference.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/electromagnetic-compatibility-emc\/\" >Electromagnetic Compatibility (EMC)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;The rapid spontaneous transfer of electrostatic charge, induced by a high electrostatic field.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/electrostatic-discharge-esd\/\" >Electrostatic Discharge (ESD)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;An electrostatic-sensitive device is any electrical component which can be damaged by common static charges which build up on people, tools, and other non-conductors or semiconductors.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/electrostatic-discharge-sensitive-devices-esds\/\" >Electrostatic Discharge Sensitive devices (ESDS)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Dissipative materials allow the charges to flow to ground more slowly in a more controlled manner than with conductive materials.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/electrostatic-dissipative\/\" >Electrostatic dissipative<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A discrete component that is fabricated as an integral part of a printed board.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/embedded-component\/\" >Embedded Component<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A controlled environment area is a specified working area that primarily controls one or more physical, chemical, or biological variables.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/environment-controlled-area\/\" >Environment Controlled Area<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;ESD Protected Are\u0430 is a workplace or area that provides protection against damage due to ESD.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/esd-protected-area-epa\/\" >ESD &#8211; Protected Area (EPA)<\/a><\/li><\/ul><\/div><div class=\"wpg-list-block wpg-filter-f mix\" data-filter-base=\"f\"><h3 class=\"wpg-list-block-heading\">F<\/h3><ul class=\"wpg-list-items\"><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Attaching a die to a base material with its circuitry facing the base material.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/face-bonding\/\" >Face Bonding<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;The number of cycles of stress that can be sustained prior to failure for a stated test condition.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/fatigue-life\/\" >Fatigue Life<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;The maximum stress below which a material can presumably endure an infinite number of stress cycles.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/fatigue-limit\/\" >Fatigue Limit<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Fiducial (Mark) provides a common measurable point for component mounting with respect to a land pattern or land patterns. Fiducials are printed boards features that are created in the same process as the conductive pattern&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/fiducial\/\" >Fiducial<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A surface-mount assembly technology with component terminations less than 0.65mm [0.025 in] centers. See also &quot;Ultra Fine-Pitch Technology&quot;&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/fine-pitch-bga-csp-chip-scale-package\/\" >Fine-Pitch BGA\/ CSP (Chip Scale Package)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A quad flad pack (QFP) package with the lead pitch at or less than 0.65mm [0.039 in] pitch centers.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/fine-pitch-qfp\/\" >Fine-Pitch QFP<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A surface-mount assembly technology with component terminations less than 0.65mm [0.025 in] centers. See also &quot;Ultra Fine-Pitch Technology&quot;.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/fine-pitch-technology-fpt\/\" >Fine-Pitch Technology (FPT)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;See &quot;Rigid-Flex Printed Board&quot;&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/flex-rigid-printed-board\/\" >Flex-Rigid Printed Board<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Flexible Printed Board is a printed board using a flexible base material only. Flexible Printed Board may be partially provided with electrically nonfunctional stiffeners and\/or coverlay.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/flexible-printed-board\/\" >Flexible Printed Board<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A leadless monolithic, circuit element structure that electrically and mechanically interconnects to a printed board through the use of conductive bumps.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/flip-chip\/\" >Flip Chip<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;The allowable time period of exposure to the environment for components and printed boards, after removal from a moisture barrier bag, dry storage or dry bake and before the start of the solder reflow process.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/floor-life\/\" >Floor Life<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Equipment that analyzes the unit under test as a complete functional entity by applying inputs and sensing outputs.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/functional-tester\/\" >Functional Tester<\/a><\/li><\/ul><\/div><div class=\"wpg-list-block wpg-filter-g mix\" data-filter-base=\"g\"><h3 class=\"wpg-list-block-heading\">G<\/h3><ul class=\"wpg-list-items\"><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Application of highly viscous compounds that are usually applied to a printed board, other substrate or component\/wire to provide mechanical support and environmental protection.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/glob-topped-encapsulation\/\" >Glob-Topped Encapsulation<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A testing process that yields only a pass or a fail condition.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/go-no-go-test\/\" >Go\/No-Go Test<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A connector interfacing device that allows for connector body movement in order to facilitate contact alignment prior to contact engagement.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/guide-pin\/\" >Guide Pin<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;An SMT lead form. Leads extending horizontally from the component body centerline, bent downward immediately past the body and then bent outward just below the bottom of the body, thus forming the shape of a gull&#039;s wing.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/gull-wing-leads\/\" >Gull Wing Leads<\/a><\/li><\/ul><\/div><div class=\"wpg-list-block wpg-filter-h mix\" data-filter-base=\"h\"><h3 class=\"wpg-list-block-heading\">H<\/h3><ul class=\"wpg-list-items\"><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;See &quot;Head on Pillow&quot;&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/head-in-pillow\/\" >Head in Pillow<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A solder defect in which the solder sphere (ball) of an area array component nad its associated solder have both melted and re-soldified, but have not combined to form an integral solder joint.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/head-on-pillow\/\" >Head on Pillow<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;The solder fillet formed in the land area behind the lead.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/heel-fillet\/\" >Heel Fillet<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A generic term for substrates or boards with a higher circuit density per unit area than conventional printed boards, often containing microvias.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/high-density-interconnect-hdi\/\" >High Density Interconnect (HDI)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A QFP with greater than 196 leads at a pitch of 0.4 millimeters&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/high-density-plastic-quad-flat-pack\/\" >High Density Plastic Quad Flat Pack<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A condition in which a hole is not completely surrounded by the land.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/hole-breakout\/\" >Hole Breakout<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A card on which a moisture-sensitive chemical is applied such that it will make a significant, perceptible change in color (hue), typicaly from blue (dry) to pink (wet) when the indicated relative humidity is exceeded. The HIC is packed inside the moisture-barrier bag, along with a desiccant, to aid in determining the level of moisture to which the moisture-sensitive devices or printed boards have been subjected.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/humidity-indicator-card-hic\/\" >Humidity Indicator Card (HIC)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A circuit comprising insulating base material with various combinations of interconnected film conductors, film components, semiconductor dice, passive components and bonding wire.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/hybrid-circuit\/\" >Hybrid Circuit<\/a><\/li><\/ul><\/div><div class=\"wpg-list-block wpg-filter-i mix\" data-filter-base=\"i\"><h3 class=\"wpg-list-block-heading\">I<\/h3><ul class=\"wpg-list-items\"><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;The application of test signals directly to a device&#039;s input terminals and sensing the results directly from device&#039;s output terminals.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/in-circuit-testing\/\" >In-Circuit Testing<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A foreign particle, metallic or nonmetallic, that may be entrapped in an insulating material, conductive layer, plating, base material, or silder connection.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/inclusion-foreign-material\/\" >Inclusion, Foreign Material<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;An aqueos flux solution of inorganic acids and halides.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/inorganic-flux\/\" >Inorganic Flux<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A material placed between two surfaces giving electrical insulation, redistribution of electrical connections, mechanical strenght and\/or controlled mechanical and thermal separation between the two surfaces.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/interposer\/\" >Interposer<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Intrusive Soldering is a process in which the solder paste for the through-hole components is applied using a stencil or syringe to accommodate through-hole components that are inserted and reflow reflow-soldered together with the surface-mount components.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/intrusive-soldering\/\" >Intrusive Soldering<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;IPC Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/ipc-standart\/\" >IPC Standart<\/a><\/li><\/ul><\/div><div class=\"wpg-list-block wpg-filter-j mix\" data-filter-base=\"j\"><h3 class=\"wpg-list-block-heading\">J<\/h3><ul class=\"wpg-list-items\"><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;The preferred surface mount lead form used on PLCCs, so named because the lead departs the package body near its Z axis centerline, is formed down and then rolled under the package. Leads so formed are shaped like letter &quot;J&quot;.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/j-leads\/\" >J-Leads<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A type of wave soldering that uses a pump to force solder up through a narrow slit to form a solder jet.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/jet-wave-soldering\/\" >Jet Wave Soldering<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A discrete electrical connection that is part of the original design, or a discrete electrical connection that is used to bridge portions of the basic conductive pattern of a printed board.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/jumper-wire\/\" >Jumper Wire<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Production control techniques that minimize inventory by delivering parts and material to a manufacturing facility just before they are incorporated into a product.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/just-in-time-jit\/\" >Just-In-Time (JIT)<\/a><\/li><\/ul><\/div><div class=\"wpg-list-block wpg-filter-k mix\" data-filter-base=\"k\"><h3 class=\"wpg-list-block-heading\">K<\/h3><ul class=\"wpg-list-items\"><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A laser-beam or abrasive-jet cut (slit) in a film component as a part of the trimming operation.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/kerf\/\" >Kerf<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A correctly fabricated printed board that serves as a standard unit by which others can be compared.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/known-good-board-kgb\/\" >Known Good Board (KGB)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A die-form semiconductor product functionally verified by probing tests equal to the expected performance of the packaged product, without full quality assurance by supplier(s). The requirements for testing are AABUS.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/known-tested-die-ktd\/\" >Known Tested Die (KTD)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;An alloy of 53% iron, 17% cobalt, 29% nikel and trace elements, with a thermal expansion approximately matching that of alumina ceramics and sealing glasses.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/kovar\/\" >Kovar<\/a><\/li><\/ul><\/div><div class=\"wpg-list-block wpg-filter-l mix\" data-filter-base=\"l\"><h3 class=\"wpg-list-block-heading\">L<\/h3><ul class=\"wpg-list-items\"><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A product made by bonding together two or more layers of material.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/laminate\/\" >Laminate<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;The absence of resin or adhesive in an area that normally contains them.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/laminate-void\/\" >Laminate Void<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A generic rectangular component package with termination lands located in a grid pattern on the bottom of the package.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/land-grid-array-lga\/\" >Land Grid Array (LGA)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;The modification of a film component&#039;s value by the partial removal of film by applying heat from a focused laser beam.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/laser-trimming\/\" >Laser Trimming<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;An alloy that does not contain more than 0.1% lead (Pb) by weight as its constituent and is used for joining components to substrates or for coating surfaces.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/lead-free-solder\/\" >Lead Free (Solder)<\/a><\/li><\/ul><\/div><div class=\"wpg-list-block wpg-filter-m mix\" data-filter-base=\"m\"><h3 class=\"wpg-list-block-heading\">M<\/h3><ul class=\"wpg-list-items\"><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A coating material, in a specific pattern, that is used to mask or protect selected areas of conductive circuitry during manufacturing or testing from the action of an etchant, plating, solder, etc.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/mask\/\" >Mask<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;The contour (convex or concave) of a shape that is the result of the surface-tension forces that take place during wetting.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/meniscus\/\" >Meniscus<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;An alphanumeric rating indicating a plastic electronic device&#039;s susceptibility to damage due to absorbed moisture when subjected to reflow soldering.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/moisture-sensitivity-level-msl\/\" >Moisture Sensitivity Level (MSL)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;The drill pattern that furnishes a break point.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/mouse-bite-low-stress-breakaway\/\" >Mouse Bite (Low Stress Breakaway)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A module that contains two or more dice and\/or minimally-packaged dice. See also &quot;Multichip Package&quot;.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/multichip-module-mcm\/\" >Multichip Module (MCM)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A packaging that contains two or more dice and\/or minimally-packaged dice. See also &quot;Multichip Module (MCM)&quot;&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/multichip-package-mcp\/\" >Multichip Package (MCP)<\/a><\/li><\/ul><\/div><div class=\"wpg-list-block wpg-filter-n mix\" data-filter-base=\"n\"><h3 class=\"wpg-list-block-heading\">N<\/h3><ul class=\"wpg-list-items\"><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;The flared condition of copper on an inner conductive layer of a multilayer printed board that is caused by hole-drilling.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/nail-heading\/\" >Nail Heading<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Etchback in which the inner conductor layer material is recessed relative to the surrounding base material.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/negative-etchback\/\" >Negative Etchback<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A departure of a quality characteristics from its intended level or state that occurs with severity sufficient to cause an associated product or service not to meet a specification requirement.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/nonconforming\/\" >Nonconforming<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A land that is not connected electricaly to the conductive pattern layer.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/nonfunctional-land\/\" >Nonfunctional Land<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;The inability of molten solder to form a metallic bond with the basis metal.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/nonwetting-solder\/\" >Nonwetting (Solder)<\/a><\/li><\/ul><\/div><div class=\"wpg-list-block wpg-filter-o mix\" data-filter-base=\"o\"><h3 class=\"wpg-list-block-heading\">O<\/h3><ul class=\"wpg-list-items\"><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;The gaseous emission from a material exposed to heat or reduced air pressure,or both.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/outgassing\/\" >Outgassing<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A solder connection that is characterized by solder surfaces that are dull, chalky, grainy, and porous or pitted.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/overheated-solder-connection\/\" >Overheated Solder Connection<\/a><\/li><\/ul><\/div><div class=\"wpg-list-block wpg-filter-p mix\" data-filter-base=\"p\"><h3 class=\"wpg-list-block-heading\">P<\/h3><ul class=\"wpg-list-items\"><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A configuration where two packaged integrated circuits are placed directly on top of each other. Can also be known as stacked packages&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/package-on-package-pop\/\" >Package on package (PoP)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;See &quot;Intrusive Soldering&quot;&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/pin-in-hole\/\" >Pin-In-Hole<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;See &quot;Intrusive Soldering&quot;&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/pin-in-paste\/\" >Pin-In-Paste<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A part (such as resistor, capacitor, inductor, or transmission line) that is formed as part of the conductive pattern of a printed board.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/printed-component\/\" >Printed Component<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A process indicator is a condition (not a defect) that identifies a characteristic that does not affect the form, fit or function of a product. Process indicators should be monitored as a part of the process control system. When the number of process indicators indicate abnormal variation in the process or identify an undesirable trend, then the process should be analyzed. This may result in action to reduce the variation and improve yields.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/process-indicator\/\" >Process Indicator<\/a><\/li><\/ul><\/div><div class=\"wpg-list-block wpg-filter-q mix\" data-filter-base=\"q\"><h3 class=\"wpg-list-block-heading\">Q<\/h3><ul class=\"wpg-list-items\"><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A generic rectangular component package, containing an electronic device, with leads on all four sides that are formed in a &quot;J&quot; shape.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/quad-flad-j-lead-qfj\/\" >Quad Flad J-Lead (QFJ)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A generic rectangular component package, containing an electronic device, with leads on all four sides that are formed in a &quot;gullwing&quot; shape.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/quad-flad-pack-qfp\/\" >Quad Flad Pack (QFP)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A QFP package with a guarding bumper&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/quad-flad-pack-with-bumper-qfpb\/\" >Quad Flad Pack with Bumper (QFPB)<\/a><\/li><\/ul><\/div><div class=\"wpg-list-block wpg-filter-r mix\" data-filter-base=\"r\"><h3 class=\"wpg-list-block-heading\">R<\/h3><ul class=\"wpg-list-items\"><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;The joining of surfaces that have been tinned and\/or have solder between them, placing them together, heating them until the solder flows, and allowing the surface and the solder to cool in the joined position.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/reflow-soldering\/\" >Reflow soldering<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;See &quot;Mask&quot;&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/resist-mask\/\" >Resist (Mask)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A printed board with both rigid and flexible base materials.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/rigid-flex-printed-board\/\" >Rigid-Flex Printed Board<\/a><\/li><\/ul><\/div><div class=\"wpg-list-block wpg-filter-s mix\" data-filter-base=\"s\"><h3 class=\"wpg-list-block-heading\">S<\/h3><ul class=\"wpg-list-items\"><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Selective soldering is the process of selectively soldering of through hole (TH) components to printed circuit boards that could not be soldered in a reflow oven in a traditional surface-mount technology (SMT) assembly process. This usually follows an SMT oven reflow process; parts to be selectively soldered are usually surrounded by parts that have been previously soldered in a surface-mount reflow process, and the selective-solder process must be sufficiently precise to avoid damaging them.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/selective-soldering\/\" >Selective Soldering<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;An effect that pulls an SMD to the center of the land by the surface tension of the silder during reflow soldering.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/self-alignment-effect\/\" >Self-Alignment Effect<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A small sphere of solder adhering to a laminate, resist, or conductor surface. (This generally occurs after wave solder or reflow soldering)&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/solder-ball\/\" >Solder Ball<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A round ball of solder used to make interconnections between a flip-chip component and a base material during controlled-collapse soldering.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/solder-bump\/\" >Solder Bump<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;See &quot;Solder Joint&quot;. See also &quot;Cold Solder Connection&quot;.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/solder-connection\/\" >Solder Connection<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Intermetallic joint with electric\/mechanical and thermal properties that connects two or more metallic surfaces by solder.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/solder-joint\/\" >Solder Joint<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A heat-resisting coating material applied to selected areas to prevent the deposition of solder upon those areas during subsequent soldering. Detailed specifications and information regarding solder resist requirements are contained in IPC-6012 and IPC-SM-840.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/solder-mask\/\" >Solder Mask<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;An opening in a solder mask.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/solder-mask-aperture\/\" >Solder Mask Aperture<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;See &quot;Solder Mask&quot;.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/solder-resist\/\" >Solder Resist<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A post or protrusion used to facilitate raising a surface mounting device above the surface of the substrate.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/stand-off\/\" >Stand-Off<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A thin sheet of material containing openings to reflect a specific pattern, designed to transfer a paste-like material to a substrate for the purpose of component attachment.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/stencil\/\" >Stencil<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A stencil with more than one stencil-foil thickness.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/step-stencil\/\" >Step Stencil<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Slack in a component lead or wire that is formed in such a way as to minimize mechanical stresses.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/stress-relief\/\" >Stress Relief<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;See &quot;Surface Mount Technology (SMT)&quot;.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/surface-mount-assembly\/\" >Surface Mount Assembly<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A leaded or leadless device (part) that is capable of being attached to a printed board by surface mounting.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/surface-mount-component-smc\/\" >Surface Mount Component (SMC)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;See &quot;Surface Mount Component (SMC)&quot;.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/surface-mount-device-smd\/\" >Surface Mount Device (SMD)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;The electrical connection of components to the surface of a conductive pattern that does not utilize component holes.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/surface-mount-technology-smt\/\" >Surface Mount Technology (SMT)<\/a><\/li><\/ul><\/div><div class=\"wpg-list-block wpg-filter-t mix\" data-filter-base=\"t\"><h3 class=\"wpg-list-block-heading\">T<\/h3><ul class=\"wpg-list-items\"><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;See &quot;Through-Hole Technology (THT)&quot;.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/through-hole-mounting\/\" >Through-Hole Mounting<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;The electrical connection of components to a conductive pattern by the use of component holes.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/through-hole-technology-tht\/\" >Through-Hole Technology (THT)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;The application of molten solder to a basis metal or surface finish for improving solderavility.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/tinning\/\" >Tinning<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A defective mounting condition whereby a leadless device has only one of its metallized terminations soldered to a land and has the other metallized termination elevated above and not soldered to its land.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/tombstoned-component\/\" >Tombstoned Component<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A pallet shape that contains SMD components in a form that makes it easy to feed them to an automatic component mounting mashine&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/tray\/\" >Tray<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;The removal of material from component by a laser beam or abrasive jet in order to modify its value.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/trimming\/\" >Trimming<\/a><\/li><\/ul><\/div><div class=\"wpg-list-block wpg-filter-u mix\" data-filter-base=\"u\"><h3 class=\"wpg-list-block-heading\">U<\/h3><ul class=\"wpg-list-items\"><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A surface-mount assembly technology with component terminations on centers less than or equal to 0.40 mm [0.0157 in].&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/ultra-fine-pitch-technology\/\" >Ultra-Fine Pitch Technology<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A bond formed when a wire is pressed against the bonding pad and the pressing mechanism is ultrasonically vibrated at high frequency (above 10Khz).&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/ultrasonic-bond\/\" >Ultrasonic Bond<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Immersion cleaning that is done by passing high-frequency soundwaves through a cleaning medium to cause microagitation.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/ultrasonic-cleaning\/\" >Ultrasonic Cleaning<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Fluxless soldering wherein molten solder is vibrated as ultrasonic frequencies while making the joint.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/ultrasonic-soldering\/\" >Ultrasonic Soldering<\/a><\/li><\/ul><\/div><div class=\"wpg-list-block wpg-filter-v mix\" data-filter-base=\"v\"><h3 class=\"wpg-list-block-heading\">V<\/h3><ul class=\"wpg-list-items\"><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A mechanical method that removes a portion of the material outlining the board, in order to facilitate ease of breakout (removal) from the manufacturing or assembly panel. See also &quot;Breakaway&quot;.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/v-groove-scoring\/\" >V-Groove (Scoring)<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Establishing by objective evidence that a process consistently produces a result or product meeting its predetermined requirements.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/validation\/\" >Validation<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Confirmation by examination and provision of objective evidence that the specified requirements have been fulfilled.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/verification\/\" >Verification<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Via is a plated hole that is used as an interlayer connection but is not intended for inserting a component lead or metallic part.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/via\/\" >Via<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;The absence of any substances in a localized area.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/void\/\" >Void<\/a><\/li><\/ul><\/div><div class=\"wpg-list-block wpg-filter-w mix\" data-filter-base=\"w\"><h3 class=\"wpg-list-block-heading\">W<\/h3><ul class=\"wpg-list-items\"><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A slice or flat disc of semiconductor material, such as pure silicon, onto which an electronic circuit may be formed.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/wafer\/\" >Wafer<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;A soldering process wherein an assembled printed board is brought in contact with the surface of a continuously flowing and circulating mass of solder&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/wave-soldering\/\" >Wave Soldering<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;The spreading of molten solder or glass on a metallic or non-metallic surface, with proper application of heat and, in some cases, flux.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/wetting\/\" >Wetting<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;Wire Bonding is a interconnection technology that uses metal wire e.g., Gold, Copper or other between a die pad and base material, lead frame etc.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/wire-bonding\/\" >Wire Bonding<\/a><\/li><\/ul><\/div><div class=\"wpg-list-block wpg-filter-x mix\" data-filter-base=\"x\"><h3 class=\"wpg-list-block-heading\">X<\/h3><ul class=\"wpg-list-items\"><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;X-out is a method of identifying a defective part within an array to ensure it is not used (populated, further processed, etc).&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/x-out\/\" >X-Out<\/a><\/li><li class=\"wpg-list-item\"><a class=\"wpg-list-item-title wpg-tooltip\" title=\"&lt;div class=&quot;wpg-tooltip-content&quot;&gt;&lt;p&gt;X-ray inspection is a technology that uses X-rays as its source, to inspect features, which are typically hidden from view. As BGA connections are not visible the only alternative is to use a low level X-ray. Using X-ray inspection is able to find faults.&lt;\/p&gt;\n&lt;\/div&gt;\" href=\"https:\/\/centillion.eu\/en\/dictionary\/x-ray-inspection\/\" >X-Ray inspection<\/a><\/li><\/ul><\/div><\/div><div class=\"wpg-clearfix\"><\/div><\/div>\n","protected":false},"excerpt":{"rendered":"<p>&nbsp;<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-6507","page","type-page","status-publish","hentry","post-no-thumbnail"],"_links":{"self":[{"href":"https:\/\/centillion.eu\/en\/wp-json\/wp\/v2\/pages\/6507","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/centillion.eu\/en\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/centillion.eu\/en\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/centillion.eu\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/centillion.eu\/en\/wp-json\/wp\/v2\/comments?post=6507"}],"version-history":[{"count":7,"href":"https:\/\/centillion.eu\/en\/wp-json\/wp\/v2\/pages\/6507\/revisions"}],"predecessor-version":[{"id":6685,"href":"https:\/\/centillion.eu\/en\/wp-json\/wp\/v2\/pages\/6507\/revisions\/6685"}],"wp:attachment":[{"href":"https:\/\/centillion.eu\/en\/wp-json\/wp\/v2\/media?parent=6507"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}