[vc_row][vc_column][vc_tta_tabs active_section=”1″][vc_tta_section title=”PUSH-PULL AND SHEAR MECHANICAL TESTS” tab_id=”1652371354192-616dbeff-ce6b”][vc_column_text]Push-Pull and Shear are destructive methods for testing of mechanical joints, soldering electronic components to PCBs, glued or welded mechanical parts and others.The tests are performed according to the customer specification and according to the requirements of standards MIL-STD-883 and IPC-TM-650.<\/p>\n
– Scope of tests:<\/p>\n
Push-Pull: 100 \u00f7 1000 N
\nShear, with rotation: 100 N
\nShear, without rotation: 2000 N
\n– Maximum sample size for test:<\/p>\n
Length: 370 mm
\nWidth: 168 mm
\nHeight: 168 mm[\/vc_column_text][\/vc_tta_section][vc_tta_section title=”X-RAY INSPECTION AND ANALYSIS” tab_id=”1652371354209-d05a115c-d7e8″][vc_column_text]X-ray analysis is a non-destructive method for quality assessing of invisible for the human eye solders of electronic components (BGA, QFN, etc.), calculation of voids in heat-emitting sites and BGA and the condition of the inner layers of PCBs. The resolution of the X-ray system is 1 \u00b5m.
\nThe analysis of PCBs is performed according to the requirements of standard IPC-A-600 and IPC-A-610 for assembled PCBs or according to acceptance criteria set by the client.<\/p>\n
– Maximum sample size for inspection and analysis:<\/p>\n
Length: 370 mm
\nWidth: 168 mm
\nHeight: 168 mm[\/vc_column_text][\/vc_tta_section][vc_tta_section title=”REPAIR WORKS OF ASSEMBLED PCBS” tab_id=”1657822560936-d8f67ded-f263″][vc_column_text]The repair works are:<\/p>\n
– Disassembly and Assembly with automatic repair station of SMT components delivered by the customer – chip type, QFP, QFN, BGA, CSP, connectors, etc .;<\/p>\n
– Replacement of supplied by the customer TH components;<\/p>\n
– Verification of the performed activities through visual inspection and X-ray analysis.<\/p>\n
The repair activities of assembled PCBs are performed according to the requirements of standard IPC 7711\/7721 or to the method and profile set by the customer.<\/p>\n
– Maximum assembled PCBs size:<\/p>\n
Length: 390 mm
\nWidth: 285 mm[\/vc_column_text][\/vc_tta_section][vc_tta_section title=”TEMPERATURE TESTS OF ELECTRONIC MODULES” tab_id=”1657822757949-f6a75ad0-a77e”][vc_column_text]Temperature tests include:<\/p>\n
– Cyclic exposure of the samples to extremely low and high temperatures according to standard JESD22-A104 or according to a profile set by the customer;<\/p>\n
– BURN IN \/ RUN IN tests with customer test setup.<\/p>\n
Temperature range from – 40 \u00b0 C to + 180 \u00b0 C, with a maximum temperature change gradient of 4.0 K \/ min.<\/p>\n
– Work area size:<\/p>\n
Length: 800 mm
\nWidth: 800 mm
\nHeight: 950 mm
\n\u041caximum approved total weight of the samples, divided into 4 pcs. shelves: 160 kg[\/vc_column_text][\/vc_tta_section][vc_tta_section title=”CLEANING OF ASSEMBLED PCBS” tab_id=”1657822930403-5448caa6-c798″][vc_column_text]The cleaning process includes:<\/p>\n
– Removal of flux residues and other contaminants on the solders and surface of the PCBs from the soldering process of SMT and TH components;<\/p>\n
– Drying of assembled PCBs;<\/p>\n
– Verification of cleaning through visual inspection according to the requirements of standard IPC-A-610.[\/vc_column_text][\/vc_tta_section][vc_tta_section title=”DRYING AND PACKAGING OF MOISTURE-SENSITIVE MATERIALS” tab_id=”1657823505031-02ff0f54-e715″][vc_column_text]The process includes:<\/p>\n
– Removal of residual moisture from moisture-sensitive electronic components and PCBs, according to the requirements of standard IPC-J-STD-033 or to customer specification.<\/p>\n
– Packaging in moisture-proof packaging, with the possibility to ensure maintenance of relative humidity \u2264 5%.[\/vc_column_text][\/vc_tta_section][vc_tta_section title=”ACTIVITIES REQUIRING A CONTROLLED ENVIRONMENT WITH CLEANLINESS CLASS ISO CLASS 6 (US1000)” tab_id=”1657823533006-decf76d0-bbd4″][vc_column_text]Along with EMS services, it is possible to perform single operations such as cleaning, assembling and packaging of electronic, optical and mechanical modules according to customer specifications.[\/vc_column_text][\/vc_tta_section][\/vc_tta_tabs][tm_button size=”lg” button=”url:%2Fkontakti%2F|title:Send%20inquiry%20″ align=”center” lg_spacing=”margin_top:35″][\/vc_column][\/vc_row]<\/p>\n","protected":false},"excerpt":{"rendered":"
[vc_row][vc_column][vc_tta_tabs active_section=”1″][vc_tta_section title=”PUSH-PULL AND SHEAR MECHANICAL TESTS” tab_id=”1652371354192-616dbeff-ce6b”][vc_column_text]Push-Pull and Shear are destructive methods for testing of mechanical joints, soldering electronic components to PCBs, glued or welded mechanical parts and others.The tests are performed according to the customer specification and according to the requirements of standards MIL-STD-883 and IPC-TM-650. – Scope of tests: Push-Pull: 100 \u00f7 1000 N Shear, with rotation: 100 N Shear, without rotation: 2000 N – Maximum sample size for test: Length: 370 mm Width: 168 mm Height: 168 mm[\/vc_column_text][\/vc_tta_section][vc_tta_section title=”X-RAY INSPECTION AND ANALYSIS” tab_id=”1652371354209-d05a115c-d7e8″][vc_column_text]X-ray analysis is a non-destructive method for quality assessing of invisible for the human eye solders of electronic components (BGA, QFN, etc.), calculation of voids in heat-emitting sites and BGA and the condition of the inner layers of PCBs. The resolution of the X-ray system is 1 \u00b5m. The analysis of PCBs is performed according to the requirements of standard IPC-A-600 and IPC-A-610 for assembled PCBs or according to acceptance criteria set by the client. – Maximum sample size for inspection and analysis: Length: 370 mm Width: 168 mm Height: 168 mm[\/vc_column_text][\/vc_tta_section][vc_tta_section title=”REPAIR WORKS OF ASSEMBLED PCBS” tab_id=”1657822560936-d8f67ded-f263″][vc_column_text]The repair works are: – Disassembly and Assembly with automatic repair station of SMT components delivered by the customer – chip type, QFP, QFN, BGA, CSP, connectors, etc .; – Replacement of supplied by the customer TH components; – Verification of the performed activities through visual inspection and X-ray analysis. The repair activities of assembled PCBs are performed according to the requirements of standard IPC 7711\/7721 or to the method and profile set by the customer. – Maximum assembled PCBs size: Length: 390 mm Width: 285 mm[\/vc_column_text][\/vc_tta_section][vc_tta_section title=”TEMPERATURE TESTS OF ELECTRONIC MODULES” tab_id=”1657822757949-f6a75ad0-a77e”][vc_column_text]Temperature tests include: – Cyclic exposure of the samples to extremely low and high temperatures according to standard JESD22-A104 or according to a profile set by the customer; – BURN IN \/ RUN IN tests with customer test setup. Temperature range from – 40 \u00b0 C to + 180 \u00b0 C, with a maximum temperature change gradient of 4.0 K \/ min. – Work area size: Length: 800 mm Width: 800 mm Height: 950 mm \u041caximum approved total weight of the samples, divided into 4 pcs. shelves: 160 kg[\/vc_column_text][\/vc_tta_section][vc_tta_section title=”CLEANING OF ASSEMBLED PCBS” tab_id=”1657822930403-5448caa6-c798″][vc_column_text]The cleaning process includes: – Removal of flux residues and other contaminants on the solders and surface of the PCBs from the soldering process of SMT and TH components; – Drying of assembled PCBs; – Verification of cleaning through visual inspection according to the requirements of standard IPC-A-610.[\/vc_column_text][\/vc_tta_section][vc_tta_section title=”DRYING AND PACKAGING OF MOISTURE-SENSITIVE MATERIALS” tab_id=”1657823505031-02ff0f54-e715″][vc_column_text]The process includes: – Removal of residual moisture from moisture-sensitive electronic components and PCBs, according to the requirements of standard IPC-J-STD-033 or to customer specification. – Packaging in moisture-proof packaging, with the possibility to ensure maintenance of relative humidity \u2264 5%.[\/vc_column_text][\/vc_tta_section][vc_tta_section title=”ACTIVITIES REQUIRING A CONTROLLED ENVIRONMENT WITH CLEANLINESS CLASS ISO CLASS 6 (US1000)” tab_id=”1657823533006-decf76d0-bbd4″][vc_column_text]Along with EMS services, it is possible to perform single operations such as cleaning, assembling and packaging of electronic, optical and mechanical modules according to customer specifications.[\/vc_column_text][\/vc_tta_section][\/vc_tta_tabs][tm_button size=”lg” button=”url:%2Fkontakti%2F|title:Send%20inquiry%20″ align=”center” lg_spacing=”margin_top:35″][\/vc_column][\/vc_row]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-5886","page","type-page","status-publish","hentry","post-no-thumbnail"],"_links":{"self":[{"href":"https:\/\/centillion.eu\/en\/wp-json\/wp\/v2\/pages\/5886","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/centillion.eu\/en\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/centillion.eu\/en\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/centillion.eu\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/centillion.eu\/en\/wp-json\/wp\/v2\/comments?post=5886"}],"version-history":[{"count":4,"href":"https:\/\/centillion.eu\/en\/wp-json\/wp\/v2\/pages\/5886\/revisions"}],"predecessor-version":[{"id":5890,"href":"https:\/\/centillion.eu\/en\/wp-json\/wp\/v2\/pages\/5886\/revisions\/5890"}],"wp:attachment":[{"href":"https:\/\/centillion.eu\/en\/wp-json\/wp\/v2\/media?parent=5886"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}