||Term / Abbr
||The American Wire Gauge (AWG) round-conductor number that is used to designate a flat conductor with an equal cross-sectional area.
|Acceptance Quality Level (AQL)
||Acceptance Quality Level (AQL)
||A specified maximum number of defects, expressed as percentage, that is considered to be acceptable quality and normally associated with statistically derived sampling plans.
||An opening in a solder paste printing stencil.
|Aspect Ratio (Stencil)
||Aspect Ratio (Stencil)
||The ratio of the width of the aperture to the thickness of the stencil-foil
||A number of parts, subassemblies or combination thereof joined together.
|Automatic Optical Inspection (AOI)
||Automatic machine control of CBAs
|BGA (Ball Grid Array)
||BGA (Ball Grid Array)
||A surface mount package wherein the balls for terminations are formed in a grid on the bottom of a package.
||Attaching a die to a base material with its circuitry facing away from the base material
||Delamination in the form of a localized swelling and separation between any of the layers of a laminated base material, or between base material and conductive foil or protective coating, or solder mask
||Bond is an interconnection that performs a permanent electrical and/or mechanical function