Text |
Term / Abbr |
Acronym |
AWG Equivalent |
AWG Equivalent |
The American Wire Gauge (AWG) round-conductor number that is used to designate a flat conductor with an equal cross-sectional area. |
Acceptance Quality Level (AQL) |
Acceptance Quality Level (AQL) |
A specified maximum number of defects, expressed as percentage, that is considered to be acceptable quality and normally associated with statistically derived sampling plans. |
Aperture |
Aperture |
An opening in a solder paste printing stencil. |
Aspect Ratio (Stencil) |
Aspect Ratio (Stencil) |
The ratio of the width of the aperture to the thickness of the stencil-foil |
Assembly |
Assembly |
A number of parts, subassemblies or combination thereof joined together. |
Automatic Optical Inspection (AOI) |
AOI |
Automatic machine control of CBAs |
BGA (Ball Grid Array) |
BGA (Ball Grid Array) |
A surface mount package wherein the balls for terminations are formed in a grid on the bottom of a package. |
Back Bonding |
Back Bonding |
Attaching a die to a base material with its circuitry facing away from the base material |
Blister |
Blister |
Delamination in the form of a localized swelling and separation between any of the layers of a laminated base material, or between base material and conductive foil or protective coating, or solder mask |
Bond |
Bond |
Bond is an interconnection that performs a permanent electrical and/or mechanical function |