Text Term / Abbr Acronym
AWG Equivalent AWG Equivalent The American Wire Gauge (AWG) round-conductor number that is used to designate a flat conductor with an equal cross-sectional area.
Acceptance Quality Level (AQL) Acceptance Quality Level (AQL) A specified maximum number of defects, expressed as percentage, that is considered to be acceptable quality and normally associated with statistically derived sampling plans.
Aperture Aperture An opening in a solder paste printing stencil.
Aspect Ratio (Stencil) Aspect Ratio (Stencil) The ratio of the width of the aperture to the thickness of the stencil-foil
Assembly Assembly A number of parts, subassemblies or combination thereof joined together.
Automatic Optical Inspection (AOI) AOI Automatic machine control of CBAs
BGA (Ball Grid Array) BGA (Ball Grid Array) A surface mount package wherein the balls for terminations are formed in a grid on the bottom of a package.
Back Bonding Back Bonding Attaching a die to a base material with its circuitry facing away from the base material
Blister Blister Delamination in the form of a localized swelling and separation between any of the layers of a laminated base material, or between base material and conductive foil or protective coating, or solder mask
Bond Bond Bond is an interconnection that performs a permanent electrical and/or mechanical function