| Text | Term / Abbr | Acronym |
|---|---|---|
| AWG Equivalent | AWG Equivalent | The American Wire Gauge (AWG) round-conductor number that is used to designate a flat conductor with an equal cross-sectional area. |
| Acceptance Quality Level (AQL) | Acceptance Quality Level (AQL) | A specified maximum number of defects, expressed as percentage, that is considered to be acceptable quality and normally associated with statistically derived sampling plans. |
| Aperture | Aperture | An opening in a solder paste printing stencil. |
| Aspect Ratio (Stencil) | Aspect Ratio (Stencil) | The ratio of the width of the aperture to the thickness of the stencil-foil |
| Assembly | Assembly | A number of parts, subassemblies or combination thereof joined together. |
| Automatic Optical Inspection (AOI) | AOI | Automatic machine control of CBAs |
| BGA (Ball Grid Array) | BGA (Ball Grid Array) | A surface mount package wherein the balls for terminations are formed in a grid on the bottom of a package. |
| Back Bonding | Back Bonding | Attaching a die to a base material with its circuitry facing away from the base material |
| Blister | Blister | Delamination in the form of a localized swelling and separation between any of the layers of a laminated base material, or between base material and conductive foil or protective coating, or solder mask |
| Bond | Bond | Bond is an interconnection that performs a permanent electrical and/or mechanical function |
