Our core business is PCB Assembly, production of electronic modules and devices in accordance with the J-STD-001, IPC-A-610 (on the quality assessment of assembled printed boards) standards, and in strict compliance with the ISO 9001 and ISO 13485 standards. All production areas constitute electrostatic protected areas (EPAs).
Modern technology, which favours the trend of ever-increasing miniaturization, used in every industry is also applied with full force to the field of electronics. We have experience in the Assembly of a wide range of PCBs, from standard rigid, flex-rigid and flexible materials to non-standard materials such as aluminium, ceramics, etc. The minimum thickness of the assembled PCBs in our portfolio is 0.3 mm FR and 0.025 mm Flex.
We assemble SMD components of size 01005, which constitute an integral part of modern high-tech products. We have experience in mounting BGA ICs, micro BGA ICs up to 80µ, CSP ICs, QFN ICs and other fine pitch components on PCBs.
When consulting our customers on their product, we make use of our know-how and extensive professional knowledge and experience in order to provide them with the right technology, which will manufacture the product in accordance with the functionality, quality, reliability, cost and completion time requirements.
Our solutions are tailored to the different stages of product development. During the development process of the customer’s prototype, we perform qualification testing, thermal cycle testing, electrical and functional testing, as well as functional testing of finished products. During the mass production process of the customer’s product, in an effort to provide the best possible service, we offer solutions that ensure higher quality and more cost-effective production.