The automated electronics Assembly is equipped with machines that allow us to produce both prototypes as well as small and medium volume assembled PCBs. Our surface mounting lines allow us to plan in a flexible manner, to maintain a uniform load during the production process and to achieve efficiency and timely order execution. They are suitable for the Assembly of all types of modern mountings – from 01005 chip components to QFP, BGA, micro BGA Ics up to 80µ and fine-pitch mountings. Our convection reflow furnaces solder components using the so-called vacuum technology in order to prevent voids from forming in the joints.
The Selective Soldering production line gives us the added flexibility we need when we assemble diversely populated PCBs with SMD elements and conventional (ТH) components.