||Term / Abbr
||An alloy of 53% iron, 17% cobalt, 29% nikel and trace elements, with a thermal expansion approximately matching that of alumina ceramics and sealing glasses.
||A product made by bonding together two or more layers of material.
||The absence of resin or adhesive in an area that normally contains them.
|Land Grid Array (LGA)
||Land Grid Array (LGA)
||A generic rectangular component package with termination lands located in a grid pattern on the bottom of the package.
||The modification of a film component's value by the partial removal of film by applying heat from a focused laser beam.
|Lead Free (Solder)
||Lead Free (Solder)
||An alloy that does not contain more than 0.1% lead (Pb) by weight as its constituent and is used for joining components to substrates or for coating surfaces.
||A coating material, in a specific pattern, that is used to mask or protect selected areas of conductive circuitry during manufacturing or testing from the action of an etchant, plating, solder, etc.
||The contour (convex or concave) of a shape that is the result of the surface-tension forces that take place during wetting.
|Moisture Sensitivity Level (MSL)
||Moisture Sensitivity Level (MSL)
||An alphanumeric rating indicating a plastic electronic device's susceptibility to damage due to absorbed moisture when subjected to reflow soldering.
|Mouse Bite (Low Stress Breakaway)
||Mouse Bite (Low Stress Breakaway)
||The drill pattern that furnishes a break point.