Text Term / Abbr Acronym
Inorganic Flux Inorganic Flux An aqueos flux solution of inorganic acids and halides.
Interposer Interposer A material placed between two surfaces giving electrical insulation, redistribution of electrical connections, mechanical strenght and/or controlled mechanical and thermal separation between the two surfaces.
Intrusive Soldering Intrusive Soldering Intrusive Soldering is a process in which the solder paste for the through-hole components is applied using a stencil or syringe to accommodate through-hole components that are inserted and reflow reflow-soldered together with the surface-mount components.
J-Leads J-Leads The preferred surface mount lead form used on PLCCs, so named because the lead departs the package body near its Z axis centerline, is formed down and then rolled under the package. Leads so formed are shaped like letter "J".
Jet Wave Soldering Jet Wave Soldering A type of wave soldering that uses a pump to force solder up through a narrow slit to form a solder jet.
Jumper Wire Jumper Wire A discrete electrical connection that is part of the original design, or a discrete electrical connection that is used to bridge portions of the basic conductive pattern of a printed board.
Just-In-Time (JIT) Just-In-Time (JIT) Production control techniques that minimize inventory by delivering parts and material to a manufacturing facility just before they are incorporated into a product.
Kerf Kerf A laser-beam or abrasive-jet cut (slit) in a film component as a part of the trimming operation.
Known Good Board (KGB) Known Good Board (KGB) A correctly fabricated printed board that serves as a standard unit by which others can be compared.
Known Tested Die (KTD) Known Tested Die (KTD) A die-form semiconductor product functionally verified by probing tests equal to the expected performance of the packaged product, without full quality assurance by supplier(s). The requirements for testing are AABUS.