||Term / Abbr
||An aqueos flux solution of inorganic acids and halides.
||A material placed between two surfaces giving electrical insulation, redistribution of electrical connections, mechanical strenght and/or controlled mechanical and thermal separation between the two surfaces.
||Intrusive Soldering is a process in which the solder paste for the through-hole components is applied using a stencil or syringe to accommodate through-hole components that are inserted and reflow reflow-soldered together with the surface-mount components.
||The preferred surface mount lead form used on PLCCs, so named because the lead departs the package body near its Z axis centerline, is formed down and then rolled under the package. Leads so formed are shaped like letter "J".
|Jet Wave Soldering
||Jet Wave Soldering
||A type of wave soldering that uses a pump to force solder up through a narrow slit to form a solder jet.
||A discrete electrical connection that is part of the original design, or a discrete electrical connection that is used to bridge portions of the basic conductive pattern of a printed board.
||Production control techniques that minimize inventory by delivering parts and material to a manufacturing facility just before they are incorporated into a product.
||A laser-beam or abrasive-jet cut (slit) in a film component as a part of the trimming operation.
|Known Good Board (KGB)
||Known Good Board (KGB)
||A correctly fabricated printed board that serves as a standard unit by which others can be compared.
|Known Tested Die (KTD)
||Known Tested Die (KTD)
||A die-form semiconductor product functionally verified by probing tests equal to the expected performance of the packaged product, without full quality assurance by supplier(s). The requirements for testing are AABUS.