||Term / Abbr
|Head on Pillow
||Head on Pillow
||A solder defect in which the solder sphere (ball) of an area array component nad its associated solder have both melted and re-soldified, but have not combined to form an integral solder joint.
||The solder fillet formed in the land area behind the lead.
|High Density Interconnect (HDI)
||High Density Interconnect (HDI)
||A generic term for substrates or boards with a higher circuit density per unit area than conventional printed boards, often containing microvias.
|High Density Plastic Quad Flat Pack
||High Density Plastic Quad Flat Pack
||A QFP with greater than 196 leads at a pitch of 0.4 millimeters
||A condition in which a hole is not completely surrounded by the land.
|Humidity Indicator Card (HIC)
||Humidity Indicator Card (HIC)
||A card on which a moisture-sensitive chemical is applied such that it will make a significant, perceptible change in color (hue), typicaly from blue (dry) to pink (wet) when the indicated relative humidity is exceeded. The HIC is packed inside the moisture-barrier bag, along with a desiccant, to aid in determining the level of moisture to which the moisture-sensitive devices or printed boards have been subjected.
||A circuit comprising insulating base material with various combinations of interconnected film conductors, film components, semiconductor dice, passive components and bonding wire.
||IPC Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and
||The application of test signals directly to a device's input terminals and sensing the results directly from device's output terminals.
|Inclusion, Foreign Material
||Inclusion, Foreign Material
||A foreign particle, metallic or nonmetallic, that may be entrapped in an insulating material, conductive layer, plating, base material, or silder connection.