Dictionary

Text Term / Abbr Acronym
Electrostatic dissipative Electrostatic dissipative Dissipative materials allow the charges to flow to ground more slowly in a more controlled manner than with conductive materials.
Embedded Component Embedded Component A discrete component that is fabricated as an integral part of a printed board.
Environment Controlled Area Environment Controlled Area A controlled environment area is a specified working area that primarily controls one or more physical, chemical, or biological variables.
Face Bonding Face Bonding Attaching a die to a base material with its circuitry facing the base material.
Fatigue Life Fatigue Life The number of cycles of stress that can be sustained prior to failure for a stated test condition.
Fatigue Limit Fatigue Limit The maximum stress below which a material can presumably endure an infinite number of stress cycles.
Fiducial Fiducial (Mark) Fiducial (Mark) provides a common measurable point for component mounting with respect to a land pattern or land patterns. Fiducials are printed boards features that are created in the same process as the conductive pattern
Fine-Pitch BGA/ CSP (Chip Scale Package) Fine-Pitch BGA/ CSP (Chip Scale Package) A surface-mount assembly technology with component terminations less than 0.65mm [0.025 in] centers. See also "Ultra Fine-Pitch Technology"
Fine-Pitch QFP Fine-Pitch QFP A quad flad pack (QFP) package with the lead pitch at or less than 0.65mm [0.039 in] pitch centers.
Fine-Pitch Technology (FPT) Fine-Pitch Technology (FPT) A surface-mount assembly technology with component terminations less than 0.65mm [0.025 in] centers. See also "Ultra Fine-Pitch Technology".