Dictionary

Text Term / Abbr Acronym
Chip Scale Package (CSP) Chip Scale Package (CSP) See "Fine Pitch BGA/Chip Scale Package"
Chip-in-Board (CIB) Chip-in-Board (CIB) An electronic component where a chip is inserted into an opening of a ceramic of glass-epoxy substrate and bonded by wire bonding or TAB techniques. The object of this technique is to reduce the thickness of the COB assembly. The chip may be covered by a resin after bonding.
Chip-on-Board (COB) Chip-on-Board (COB) A printed board assembly technology that places unpackaged semiconductor dice and interconects them by a wire bonding or similar attachment techniques. Silicon area density is usualy less than that of the printed board.
Chip-on-Flex (COF) Chip-on-Flex (COF) Semiconductor chip mounted directly onto flexible printed board.
Cold Solder Connection Cold Solder Connection A solder connection that exhibits poor wetting, and that is characterized by a grayish, porous appearance. (This is due to excessive impurities in the solder, inadequate cleaning prior to soldering, and/or the insufficient application of heat during the soldering process.)
Component 0201 0201 Chip component with dimensions 0.024 in × 0.012 in (imperial); 0.6 mm × 0.3 mm (metric)
Conformal Coating Conformal Coating Conformal Coating providing a protective barrier against deleterious effects from enviromental conditions. Conformal Coating is an insulating protective covering that conforms to the configuration of the objects coated. For example printed boards, printed boards assembly.
Cupping (BGA) Cupping (BGA) A condition of a ball grid array (BGA) package after reflow where the corners turn up and away from the printed board laminate surface. This condition in the worse case causes the balls on the outside row to be in tension and the balls in the center to be in compression. (Opposite of "Doming (BGA).")
Damage Response (Plastic Encapsulated SMDs) Damage Response (Plastic Encapsulated SMDs) All irreversible changes caused by exposure to a reflow soldering profile.
Delamination Delamination Delamination is a separation between plies within a base materialq between a base material and a conductive foilq or any other planar separation within a printed board. For mechanical separation see "Blister" and "Haloing"