||Term / Abbr
||The ability of a surface to be bonded, dependent upon degree of surface preparation, as in cleanliness and texture
||Fine gold or aluminium wire used for making electrical connections between lands, lead frames, and terminals.
||The function of excising pronted boards or printed board assemblies from their panel structure after all processing has been completed.
||A semiconductor wafer with raised metal features on its die lands that facilitate inner-lead bonding.
||Burn-In is the process of electrically stressing a device at an elevated temperature, for sufficient amount of time to cause the failure of marginal devices. This early failures of products are also known as Infant Mortality.
||Small lumps or masses with an irregular shape, convex to a surface, which occur as a result of a machine process such as drilling or gouging.
|Capability Test Board (CTB)
||Capability Test Board (CTB)
||A printed board specifically designed to act as a capability qualifying component (CQC), or to be used by manufacturer to evaluate process variation, provess control, or continuous improvement procedures.
|Ceramic Dual-in-line Package (CERDIP)
||Ceramic Dual-in-line Package (CERDIP)
||A dual in-line-package that has a package body of ceramic material and hermetically sealed by glass. (See also "Dual-in-line Package.")
|Ceramic Pin Grid Aray (CPGA)
||Ceramic Pin Grid Aray (CPGA)
||A pin grid aray package (PGA) made of a ceramic material, hermetically sealed by metal, with leads formed on a grid extending from the bottom of the package.
|Ceramic Quad Flat Pack (CQFP)
||Ceramic Quad Flat Pack (CQFP)
||A quad flad pack (QFP) made of a ceramic material, hermetically sealed by metal, with leads extending grom all four sides.