||Term / Abbr
||A defective mounting condition whereby a leadless device has only one of its metallized terminations soldered to a land and has the other metallized termination elevated above and not soldered to its land.
||A pallet shape that contains SMD components in a form that makes it easy to feed them to an automatic component mounting mashine
||The removal of material from component by a laser beam or abrasive jet in order to modify its value.
|Ultra-Fine Pitch Technology
||Ultra-Fine Pitch Technology
||A surface-mount assembly technology with component terminations on centers less than or equal to 0.40 mm [0.0157 in].
||A bond formed when a wire is pressed against the bonding pad and the pressing mechanism is ultrasonically vibrated at high frequency (above 10Khz).
||Immersion cleaning that is done by passing high-frequency soundwaves through a cleaning medium to cause microagitation.
||Fluxless soldering wherein molten solder is vibrated as ultrasonic frequencies while making the joint.
||A mechanical method that removes a portion of the material outlining the board, in order to facilitate ease of breakout (removal) from the manufacturing or assembly panel. See also "Breakaway".
||Establishing by objective evidence that a process consistently produces a result or product meeting its predetermined requirements.
||Confirmation by examination and provision of objective evidence that the specified requirements have been fulfilled.