Text Term / Abbr Acronym
Tombstoned Component Tombstone A defective mounting condition whereby a leadless device has only one of its metallized terminations soldered to a land and has the other metallized termination elevated above and not soldered to its land.
Tray Tray A pallet shape that contains SMD components in a form that makes it easy to feed them to an automatic component mounting mashine
Trimming Trimming The removal of material from component by a laser beam or abrasive jet in order to modify its value.
Ultra-Fine Pitch Technology Ultra-Fine Pitch Technology A surface-mount assembly technology with component terminations on centers less than or equal to 0.40 mm [0.0157 in].
Ultrasonic Bond Ultrasonic Bond A bond formed when a wire is pressed against the bonding pad and the pressing mechanism is ultrasonically vibrated at high frequency (above 10Khz).
Ultrasonic Cleaning Ultrasonic Cleaning Immersion cleaning that is done by passing high-frequency soundwaves through a cleaning medium to cause microagitation.
Ultrasonic Soldering Ultrasonic Soldering Fluxless soldering wherein molten solder is vibrated as ultrasonic frequencies while making the joint.
V-Groove (Scoring) V-Groove (Scoring) A mechanical method that removes a portion of the material outlining the board, in order to facilitate ease of breakout (removal) from the manufacturing or assembly panel. See also "Breakaway".
Validation Validation Establishing by objective evidence that a process consistently produces a result or product meeting its predetermined requirements.
Verification Verification Confirmation by examination and provision of objective evidence that the specified requirements have been fulfilled.