||Term / Abbr
||A thin sheet of material containing openings to reflect a specific pattern, designed to transfer a paste-like material to a substrate for the purpose of component attachment.
||A stencil with more than one stencil-foil thickness.
||Slack in a component lead or wire that is formed in such a way as to minimize mechanical stresses.
|Surface Mount Assembly
||Surface Mount Assembly
||See "Surface Mount Technology (SMT)".
|Surface Mount Component (SMC)
||Surface Mount Component (SMC)
||A leaded or leadless device (part) that is capable of being attached to a printed board by surface mounting.
|Surface Mount Device (SMD)
||Surface Mount Device (SMD)
||See "Surface Mount Component (SMC)".
|Surface Mount Technology (SMT)
||Surface Mount Technology (SMT)
||The electrical connection of components to the surface of a conductive pattern that does not utilize component holes.
||See "Through-Hole Technology (THT)".
|Through-Hole Technology (THT)
||Through-Hole Technology (THT)
||The electrical connection of components to a conductive pattern by the use of component holes.
||The application of molten solder to a basis metal or surface finish for improving solderavility.