||Term / Abbr
||Selective soldering is the process of selectively soldering of through hole (TH) components to printed circuit boards that could not be soldered in a reflow oven in a traditional surface-mount technology (SMT) assembly process. This usually follows an SMT oven reflow process; parts to be selectively soldered are usually surrounded by parts that have been previously soldered in a surface-mount reflow process, and the selective-solder process must be sufficiently precise to avoid damaging them.
||An effect that pulls an SMD to the center of the land by the surface tension of the silder during reflow soldering.
||A small sphere of solder adhering to a laminate, resist, or conductor surface. (This generally occurs after wave solder or reflow soldering)
||A round ball of solder used to make interconnections between a flip-chip component and a base material during controlled-collapse soldering.
||See "Solder Joint". See also "Cold Solder Connection".
||Intermetallic joint with electric/mechanical and thermal properties that connects two or more metallic surfaces by solder.
||A heat-resisting coating material applied to selected areas to prevent the deposition of solder upon those areas during subsequent soldering. Detailed specifications and information regarding solder resist requirements are contained in IPC-6012 and IPC-SM-840.
|Solder Mask Aperture
||Solder Mask Aperture
||An opening in a solder mask.
||See "Solder Mask".
||A post or protrusion used to facilitate raising a surface mounting device above the surface of the substrate.