||Term / Abbr
|Multichip Module (MCM)
||Multichip Module (MCM)
||A module that contains two or more dice and/or minimally-packaged dice. See also "Multichip Package".
|Multichip Package (MCP)
||Multichip Package (MCP)
||A packaging that contains two or more dice and/or minimally-packaged dice. See also "Multichip Module (MCM)"
||The flared condition of copper on an inner conductive layer of a multilayer printed board that is caused by hole-drilling.
||Etchback in which the inner conductor layer material is recessed relative to the surrounding base material.
||A departure of a quality characteristics from its intended level or state that occurs with severity sufficient to cause an associated product or service not to meet a specification requirement.
||A land that is not connected electricaly to the conductive pattern layer.
||The inability of molten solder to form a metallic bond with the basis metal.
||The gaseous emission from a material exposed to heat or reduced air pressure,or both.
|Overheated Solder Connection
||Overheated Solder Connection
||A solder connection that is characterized by solder surfaces that are dull, chalky, grainy, and porous or pitted.
|Package on package (PoP)
||Package on package (PoP)
||A configuration where two packaged integrated circuits are placed directly on top of each other. Can also be known as stacked packages