||Term / Abbr
||A slice or flat disc of semiconductor material, such as pure silicon, onto which an electronic circuit may be formed.
||A soldering process wherein an assembled printed board is brought in contact with the surface of a continuously flowing and circulating mass of solder
||The spreading of molten solder or glass on a metallic or non-metallic surface, with proper application of heat and, in some cases, flux.
||Wire Bonding is a interconnection technology that uses metal wire e.g., Gold, Copper or other between a die pad and base material, lead frame etc.