||Term / Abbr
|Ultra-Fine Pitch Technology
||Ultra-Fine Pitch Technology
||A surface-mount assembly technology with component terminations on centers less than or equal to 0.40 mm [0.0157 in].
||A bond formed when a wire is pressed against the bonding pad and the pressing mechanism is ultrasonically vibrated at high frequency (above 10Khz).
||Immersion cleaning that is done by passing high-frequency soundwaves through a cleaning medium to cause microagitation.
||Fluxless soldering wherein molten solder is vibrated as ultrasonic frequencies while making the joint.