Text Term / Abbr Acronym
Ultra-Fine Pitch Technology Ultra-Fine Pitch Technology A surface-mount assembly technology with component terminations on centers less than or equal to 0.40 mm [0.0157 in].
Ultrasonic Bond Ultrasonic Bond A bond formed when a wire is pressed against the bonding pad and the pressing mechanism is ultrasonically vibrated at high frequency (above 10Khz).
Ultrasonic Cleaning Ultrasonic Cleaning Immersion cleaning that is done by passing high-frequency soundwaves through a cleaning medium to cause microagitation.
Ultrasonic Soldering Ultrasonic Soldering Fluxless soldering wherein molten solder is vibrated as ultrasonic frequencies while making the joint.