||Term / Abbr
||See "Through-Hole Technology (THT)".
|Through-Hole Technology (THT)
||Through-Hole Technology (THT)
||The electrical connection of components to a conductive pattern by the use of component holes.
||The application of molten solder to a basis metal or surface finish for improving solderavility.
||A defective mounting condition whereby a leadless device has only one of its metallized terminations soldered to a land and has the other metallized termination elevated above and not soldered to its land.
||A pallet shape that contains SMD components in a form that makes it easy to feed them to an automatic component mounting mashine
||The removal of material from component by a laser beam or abrasive jet in order to modify its value.