||Term / Abbr
||The flared condition of copper on an inner conductive layer of a multilayer printed board that is caused by hole-drilling.
||Etchback in which the inner conductor layer material is recessed relative to the surrounding base material.
||A departure of a quality characteristics from its intended level or state that occurs with severity sufficient to cause an associated product or service not to meet a specification requirement.
||A land that is not connected electricaly to the conductive pattern layer.
||The inability of molten solder to form a metallic bond with the basis metal.