||Term / Abbr
||A coating material, in a specific pattern, that is used to mask or protect selected areas of conductive circuitry during manufacturing or testing from the action of an etchant, plating, solder, etc.
||The contour (convex or concave) of a shape that is the result of the surface-tension forces that take place during wetting.
|Moisture Sensitivity Level (MSL)
||Moisture Sensitivity Level (MSL)
||An alphanumeric rating indicating a plastic electronic device's susceptibility to damage due to absorbed moisture when subjected to reflow soldering.
|Mouse Bite (Low Stress Breakaway)
||Mouse Bite (Low Stress Breakaway)
||The drill pattern that furnishes a break point.
|Multichip Module (MCM)
||Multichip Module (MCM)
||A module that contains two or more dice and/or minimally-packaged dice. See also "Multichip Package".
|Multichip Package (MCP)
||Multichip Package (MCP)
||A packaging that contains two or more dice and/or minimally-packaged dice. See also "Multichip Module (MCM)"