||Term / Abbr
|Head in Pillow
||Head in Pillow
||See "Head on Pillow"
|Head on Pillow
||Head on Pillow
||A solder defect in which the solder sphere (ball) of an area array component nad its associated solder have both melted and re-soldified, but have not combined to form an integral solder joint.
||The solder fillet formed in the land area behind the lead.
|High Density Interconnect (HDI)
||High Density Interconnect (HDI)
||A generic term for substrates or boards with a higher circuit density per unit area than conventional printed boards, often containing microvias.
|High Density Plastic Quad Flat Pack
||High Density Plastic Quad Flat Pack
||A QFP with greater than 196 leads at a pitch of 0.4 millimeters
||A condition in which a hole is not completely surrounded by the land.
|Humidity Indicator Card (HIC)
||Humidity Indicator Card (HIC)
||A card on which a moisture-sensitive chemical is applied such that it will make a significant, perceptible change in color (hue), typicaly from blue (dry) to pink (wet) when the indicated relative humidity is exceeded. The HIC is packed inside the moisture-barrier bag, along with a desiccant, to aid in determining the level of moisture to which the moisture-sensitive devices or printed boards have been subjected.
||A circuit comprising insulating base material with various combinations of interconnected film conductors, film components, semiconductor dice, passive components and bonding wire.