||Term / Abbr
||Attaching a die to a base material with its circuitry facing the base material.
||The number of cycles of stress that can be sustained prior to failure for a stated test condition.
||The maximum stress below which a material can presumably endure an infinite number of stress cycles.
||Fiducial (Mark) provides a common measurable point for component mounting with respect to a land pattern or land patterns. Fiducials are printed boards features that are created in the same process as the conductive pattern
|Fine-Pitch BGA/ CSP (Chip Scale Package)
||Fine-Pitch BGA/ CSP (Chip Scale Package)
||A surface-mount assembly technology with component terminations less than 0.65mm [0.025 in] centers. See also "Ultra Fine-Pitch Technology"
||A quad flad pack (QFP) package with the lead pitch at or less than 0.65mm [0.039 in] pitch centers.
|Fine-Pitch Technology (FPT)
||Fine-Pitch Technology (FPT)
||A surface-mount assembly technology with component terminations less than 0.65mm [0.025 in] centers. See also "Ultra Fine-Pitch Technology".
|Flex-Rigid Printed Board
||Flex-Rigid Printed Board
||See "Rigid-Flex Printed Board"
|Flexible Printed Board
||Flexible Printed Board
||Flexible Printed Board is a printed board using a flexible base material only. Flexible Printed Board may be partially provided with electrically nonfunctional stiffeners and/or coverlay.
||A leadless monolithic, circuit element structure that electrically and mechanically interconnects to a printed board through the use of conductive bumps.