Dictionary

F
Text Term / Abbr Acronym
Face Bonding Face Bonding Attaching a die to a base material with its circuitry facing the base material.
Fatigue Life Fatigue Life The number of cycles of stress that can be sustained prior to failure for a stated test condition.
Fatigue Limit Fatigue Limit The maximum stress below which a material can presumably endure an infinite number of stress cycles.
Fiducial Fiducial (Mark) Fiducial (Mark) provides a common measurable point for component mounting with respect to a land pattern or land patterns. Fiducials are printed boards features that are created in the same process as the conductive pattern
Fine-Pitch BGA/ CSP (Chip Scale Package) Fine-Pitch BGA/ CSP (Chip Scale Package) A surface-mount assembly technology with component terminations less than 0.65mm [0.025 in] centers. See also "Ultra Fine-Pitch Technology"
Fine-Pitch QFP Fine-Pitch QFP A quad flad pack (QFP) package with the lead pitch at or less than 0.65mm [0.039 in] pitch centers.
Fine-Pitch Technology (FPT) Fine-Pitch Technology (FPT) A surface-mount assembly technology with component terminations less than 0.65mm [0.025 in] centers. See also "Ultra Fine-Pitch Technology".
Flex-Rigid Printed Board Flex-Rigid Printed Board See "Rigid-Flex Printed Board"
Flexible Printed Board Flexible Printed Board Flexible Printed Board is a printed board using a flexible base material only. Flexible Printed Board may be partially provided with electrically nonfunctional stiffeners and/or coverlay.
Flip Chip Flip Chip A leadless monolithic, circuit element structure that electrically and mechanically interconnects to a printed board through the use of conductive bumps.