Text Term / Abbr Acronym
BGA (Ball Grid Array) BGA (Ball Grid Array) A surface mount package wherein the balls for terminations are formed in a grid on the bottom of a package.
Back Bonding Back Bonding Attaching a die to a base material with its circuitry facing away from the base material
Blister Blister Delamination in the form of a localized swelling and separation between any of the layers of a laminated base material, or between base material and conductive foil or protective coating, or solder mask
Bond Bond Bond is an interconnection that performs a permanent electrical and/or mechanical function
Bondability Bondability The ability of a surface to be bonded, dependent upon degree of surface preparation, as in cleanliness and texture
Bonding Wire Bonding Wire Fine gold or aluminium wire used for making electrical connections between lands, lead frames, and terminals.
Breakaway Breakaway The function of excising pronted boards or printed board assemblies from their panel structure after all processing has been completed.
Bumped Wafer Bumped Wafer A semiconductor wafer with raised metal features on its die lands that facilitate inner-lead bonding.
Burn-In Burn-In Burn-In is the process of electrically stressing a device at an elevated temperature, for sufficient amount of time to cause the failure of marginal devices. This early failures of products are also known as Infant Mortality.
Burr Burr Small lumps or masses with an irregular shape, convex to a surface, which occur as a result of a machine process such as drilling or gouging.