||Term / Abbr
|BGA (Ball Grid Array)
||BGA (Ball Grid Array)
||A surface mount package wherein the balls for terminations are formed in a grid on the bottom of a package.
||Attaching a die to a base material with its circuitry facing away from the base material
||Delamination in the form of a localized swelling and separation between any of the layers of a laminated base material, or between base material and conductive foil or protective coating, or solder mask
||Bond is an interconnection that performs a permanent electrical and/or mechanical function
||The ability of a surface to be bonded, dependent upon degree of surface preparation, as in cleanliness and texture
||Fine gold or aluminium wire used for making electrical connections between lands, lead frames, and terminals.
||The function of excising pronted boards or printed board assemblies from their panel structure after all processing has been completed.
||A semiconductor wafer with raised metal features on its die lands that facilitate inner-lead bonding.
||Burn-In is the process of electrically stressing a device at an elevated temperature, for sufficient amount of time to cause the failure of marginal devices. This early failures of products are also known as Infant Mortality.
||Small lumps or masses with an irregular shape, convex to a surface, which occur as a result of a machine process such as drilling or gouging.